Inventor
CHENG-HUNG YEH
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
G06FElectric digital data processing20%
H01LSemiconductor devices20%
H10DInorganic electric semiconductor devices10%
G11CStatic stores5%
H01GCapacitors5%
H01RElectrically-conductive connections5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,424,515SOIC chip architecture202512,223,252Through-silicon via in integrated circuit packaging202511,694,973Electromagnetic shielding metal-insulator-metal capacitor structure202311,586,797Through-silicon vias in integrated circuit packaging202311,387,177Package structure and method for forming the same202211,367,695Interposer with capacitors2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2022–2025 |