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Inventor

Takao Ikezawa

Inventor
Shinjuku-ku, JP

Overview

3→
Patents
2013–2014
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
Y10TTechnical subjects covered by former us classification33%
C25DProcesses for the electrolytic or electrophoretic production of coatings17%
PatentTitleYear
8,739,401'Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member'20148,742,554'Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member'20148,420,446'Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2014Patents assigned to DAINIPPON PRINTING CO LTD (3)· patent assignee history
2013–2014Patents assigned to FUKUCHI MASARU (3)· patent assignee history
2013–2014Patents assigned to IKEZAWA TAKAO (3)· patent assignee history
2013–2014Patents assigned to MASUDA MASACHIKA (3)· patent assignee history
2013–2014Patents assigned to MATSUMURA KENJI (3)· patent assignee history
2013–2014Based in Shinjuku-ku, JP· patent location history
2014Based in Saitama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DAINIPPON PRINTING CO LTD32013–2014
FUKUCHI MASARU32013–2014
IKEZAWA TAKAOself32013–2014
MASUDA MASACHIKA32013–2014
MATSUMURA KENJI32013–2014
Locations
LocationPatentsSpan
Shinjuku-ku, JP22013–2014
Saitama, JP12014