Inventor
Wen-Chiang Tu
Inventor
Mountain View, CA, US
Overview
Patents· 39 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
G01BMeasuring length, thickness or similar linear dimensions5%
H10NElectric solid-state devices not otherwise provided for3%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials2%
C01GCompounds containing metals not covered by subclasses c01d or c01f2%
G06FElectric digital data processing2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
10,741,459Inductive monitoring of conductive loops202010,589,397Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing202010,556,315Determination of gain for eddy current sensor202010,464,184Modifying substrate thickness profiles201910,207,386Determination of gain for eddy current sensor201910,199,281Substrate features for inductive monitoring of conductive trench depth201910,103,073Inductive monitoring of conductive trench depth20189,911,664'Substrate features for inductive monitoring of conductive trench depth'20189,754,846'Inductive monitoring of conductive trench depth'20179,636,797'Adjusting eddy current measurements'20179,496,190'Feedback of layer thickness timing and clearance timing for polishing control'20169,472,475'Feedback control using detection of clearance and adjustment for uniform topography'20169,296,084'Polishing control using weighting with default sequence'20169,281,253'Determination of gain for eddy current sensor'20169,275,917'Determination of gain for eddy current sensor'20169,248,544'Endpoint detection during polishing using integrated differential intensity'20169,205,527'In-situ monitoring system with monitoring of elongated region'20159,186,774'X-ray metrology for control of polishing'20159,073,169'Feedback control of polishing using optical detection of clearance'20159,067,295'Monitoring retaining ring thickness and pressure control'20159,023,667'High sensitivity eddy current monitoring system'20159,005,999'Temperature control of chemical mechanical polishing'20158,989,890'GST film thickness monitoring'20158,860,932'Detection of layer clearing using spectral monitoring'20148,694,144'Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing'20148,679,979'Using optical metrology for within wafer feed forward process control'20148,639,377'Metrology for GST film thickness and phase'20148,586,481'Chemical planarization of copper wafer polishing'20138,579,675'Methods of using optical metrology for feed back and feed forward process control'20138,292,693'Using optical metrology for wafer to wafer feed back process control'20128,210,900'Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery'20128,039,397'Using optical metrology for within wafer feed forward process control'20117,323,416'Method and composition for polishing a substrate'20086,872,128'System, method and apparatus for applying liquid to a CMP polishing pad'20056,544,887'Polycide etch process'20036,372,633'Method and apparatus for forming metal interconnects'20026,199,927'Robot blade for handling of semiconductor substrates'20016,153,530'Post-etch treatment of plasma-etched feature surfaces to prevent corrosion'20006,024,393'Robot blade for handling of semiconductor substrate'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2020Patents assigned to APPLIED MATERIALS INC (37)· patent assignee history
2000–2020Based in Mountain View, CA, US· patent location history
2002Based in Sunnyvale, CA, US· patent location history
2003–2005Based in Fremont, CA, US· patent location history
2008Based in Mountainview, CA, US· patent location history
2012–2016Patents assigned to TU WEN-CHIANG (14)· patent assignee history
2012–2015Patents assigned to SWEDEK BOGUSLAW A (7)· patent assignee history
2012–2016Patents assigned to LEE HARRY Q (6)· patent assignee history
2012–2015Patents assigned to BENVEGNU DOMINIC J (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 37 | 2000–2020 |
| TU WEN-CHIANGself | 14 | 2012–2016 |
| SWEDEK BOGUSLAW A | 7 | 2012–2015 |
| LEE HARRY Q | 6 | 2012–2016 |
| BENVEGNU DOMINIC J | 5 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mountain View, California, US | 35 | 2000–2020 |
| Fremont, California, US | 2 | 2003–2005 |
| Mountainview, California, US | 1 | 2008 |
| Sunnyvale, California, US | 1 | 2002 |