Inventor
Yuchun Wang
Inventor
San Jose, CA, US
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
C09GPolishing compositions8%
B82YSpecific uses or applications of nanostructures5%
G01BMeasuring length, thickness or similar linear dimensions5%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool4%
B24DTools for grinding, buffing or sharpening4%
G01VGeophysics3%
H10NElectric solid-state devices not otherwise provided for3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
PatentTitleYear
11,067,764Optical transceiver20219,496,190'Feedback of layer thickness timing and clearance timing for polishing control'20169,073,169'Feedback control of polishing using optical detection of clearance'20158,989,890'GST film thickness monitoring'20158,855,440'Structure-independent analysis of 3-D seismic random noise'20148,639,377'Metrology for GST film thickness and phase'20148,586,481'Chemical planarization of copper wafer polishing'20138,221,193'Closed loop control of pad profile based on metrology feedback'20128,210,900'Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery'20128,170,288'Reducing noise in 3D seismic data while preserving structural details'20128,012,000'Extended pad life for ECMP and barrier removal'20117,955,519'Composition and method for planarizing surfaces'20117,653,258'Enhanced isotropic 2D and 3D gradient method'20107,454,292'Inverse-vector method for smoothing dips and azimuths'20087,344,432'Conductive pad with ion exchange membrane for electrochemical mechanical polishing'20087,311,592'Conductive polishing article for electrochemical mechanical polishing'20077,137,879'Conductive polishing article for electrochemical mechanical polishing'20067,091,604'Three dimensional integrated circuits'20067,066,800'Conductive polishing article for electrochemical mechanical polishing'20066,988,942'Conductive polishing article for electrochemical mechanical polishing'20066,984,587'Integrated polishing and electroless deposition'20066,942,546'Endpoint detection for non-transparent polishing member'20056,926,589'Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing'20056,908,374'Chemical mechanical polishing endpoint detection'20056,899,804'Electrolyte composition and treatment for electrolytic chemical mechanical polishing'20056,872,329'Chemical mechanical polishing composition and process'20056,857,947'Advanced chemical mechanical polishing system with smart endpoint detection'20056,783,432'Additives for pressure sensitive polishing compositions'20046,657,726'In situ measurement of slurry distribution'20036,638,143'Ion exchange materials for chemical mechanical polishing'20036,572,453'Multi-fluid polishing process'20036,569,349'Additives to CMP slurry to polish dielectric films'20036,561,873'Method and apparatus for enhanced CMP using metals having reductive properties'20036,537,144'Method and apparatus for enhanced CMP using metals having reductive properties'20036,520,840'CMP slurry for planarizing metals'20036,435,944'CMP slurry for planarizing metals'20026,265,026'Vapor phase deposition'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2016Patents assigned to APPLIED MATERIALS INC (24)· patent assignee history
2002–2003Based in Cupertino, CA, US· patent location history
2003–2008Based in San Jose, CA, US· patent location history
2005Patents assigned to ASM NUTOOL INC (3)· patent assignee history
2005–2011Based in Naperville, IL, US· patent location history
2008–2014Patents assigned to SAUDI ARABIAN OIL CO (4)· patent assignee history
2008–2014Based in Dhahran, SA· patent location history
2011–2016Based in Santa Clara, CA, US· patent location history
2012–2015Patents assigned to WANG YUCHUN (6)· patent assignee history
2012–2015Patents assigned to TU WEN-CHIANG (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 24 | 2002–2016 |
| WANG YUCHUNself | 6 | 2012–2015 |
| TU WEN-CHIANG | 5 | 2012–2015 |
| SAUDI ARABIAN OIL CO | 4 | 2008–2014 |
| ASM NUTOOL INC | 3 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 15 | 2003–2008 |
| Santa Clara, California, US | 8 | 2011–2016 |
| Dhahran, SA | 4 | 2008–2014 |
| Naperville, Illinois, US | 4 | 2005–2011 |
| Cupertino, California, US | 4 | 2002–2003 |