Inventor
Kuo-Chuan Chen
Inventor
Hsinchu, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
Y10TTechnical subjects covered by former us classification18%
C23CCoating metallic material9%
G01NInvestigating or analysing materials by determining their chemical or physical properties9%
H01JElectric discharge tubes or discharge lamps9%
H03HImpedance networks, e.g. resonant circuits9%
H05KPrinted circuits9%
PatentTitleYear
6,851,168'Collar removing clamp for HDP chamber'20056,539,624'Method for forming wafer level package'20036,444,561'Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips'20026,358,836'Wafer level package incorporating elastomeric pads in dummy plugs'20026,277,669'Wafer level packaging method and packages formed'20016,137,708'Method for forming multi-chip sensing device and device formed'20005,945,774'Open package for crystal oscillator chips'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2003Patents assigned to IND TECH RES INST (6)· patent assignee history
1999–2003Based in Hsinchu, TW· patent location history
2000Based in Hsin Chu, TW· patent location history
2005Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history
2005Based in Changhua County, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 6 | 1999–2003 |
| TAIWAN SEMICONDUCTOR MFG | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 1999–2003 |
| Changhua County, TW | 1 | 2005 |
| Hsin Chu, TW | 1 | 2000 |