Inventor
MICHAEL HUBER
Inventor
DE
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Mprimary
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy9%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution9%
H04LTransmission of digital information, e.g. telegraphic communication7%
H04WWireless communication networks7%
A61KPreparations for medical, dental or toiletry purposes4%
A61NElectrotherapy4%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations4%
B60LPropulsion of electrically-propelled vehicles4%
C07KPeptides4%
C12NMicroorganisms or enzymes4%
PatentTitleYear
12,580,301Annular device formation202612,521,572Multi-system synchronization for surface-guided radiation therapy202612,410,243Methods of treating HIV-1 infection utilizing broadly neutralizing human immunodeficiency virus type 1 (HIV-1) GP120-specific monoclonal antibodies202512,382,754Optoelectronic semiconductor device comprising an insulating layer and method of manufacturing the optoelectronic semiconductor device202512,333,738Methods, systems and computer readable mediums for evaluating and displaying a breathing motion202512,267,677Methods and apparatuses for facilitating connection to a WiFi network202512,155,080Protective unit for a battery module of a high-voltage battery, battery module, and high-voltage battery202412,145,002Method and apparatus to facilitate properly positioning a patient202412,113,192Battery system and battery module202412,058,128Setting up a connection202412,051,640Chip card body, method for forming a chip card body and chip card202411,845,789Methods of treating HIV-1 infection utilizing broadly neutralizing human immunodeficiency virus type 1 (HIV-1) GP120-specific monoclonal antibodies202311,824,641Access to a service202311,705,370Semiconductor component having a compressive strain layer and method for producing the semiconductor component having a compressive strain layer202311,605,853Energy store having a cooling device and motor vehicle having an energy store202311,600,873High-voltage accumulator202311,476,389Method for producing an optoelectronic semiconductor chip having structures at the radiation passage surface, and optoelectronic semiconductor chip having structures at the radiation passage surface202211,373,663Solution for determining an authenticity of an audio stream of a voice call202211,319,362Methods of treating HIV-1 infection utilizing broadly neutralizing human immunodeficiency virus type 1 (HIV-1) GP120-specific monoclonal antibodies202211,317,281Method and a network device for providing services to user devices in a wireless network202211,307,905Method and a device comprising an edge cloud agent for providing a service202211,249,317Device for collimating a light beam, high-power laser, and focusing optical unit and method for collimating a light beam202211,183,720Cooling device for a battery assembly, and unit including a battery assembly and a cooling device202111,183,905Winding machine202111,165,108High voltage accumulator2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to BAYERISCHE MOTOREN WERKE AG (6)· patent assignee history
2021–2026Based in DE· patent location history
2022–2025Patents assigned to TELIA CO AB (6)· patent assignee history
2022–2025Patents assigned to SCRIPPS RESEARCH INST (3)· patent assignee history
2022–2025Patents assigned to THERACLONE SCIENCES INC (3)· patent assignee history
2022–2026Based in CH· patent location history
2022–2025Based in SE· patent location history
2024–2026Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BAYERISCHE MOTOREN WERKE AG | 6 | 2021–2024 |
| TELIA CO AB | 6 | 2022–2025 |
| SCRIPPS RESEARCH INST | 3 | 2022–2025 |
| THERACLONE SCIENCES INC | 3 | 2022–2025 |
| INFINEON TECHNOLOGIES AG | 2 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 12 | 2021–2026 |
| CH | 7 | 2022–2026 |
| SE | 6 | 2022–2025 |