Inventor
William J. Tkazyik
Inventor
Hyde Park, NY, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections70%
B23KSoldering or unsoldering10%
H05KPrinted circuits10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
PatentTitleYear
6,137,075'Method and apparatus for producing an electrical bond between conductors and electrical connector contacts'20006,064,026'Method for producing an electrical bond between conductors and electrical connector contacts'20005,873,743'High-density and high-speed cable assembly'19995,622,520'High-density board connector attachment'19975,433,631'Flex circuit card elastomeric cable connector assembly'19955,386,344'Flex circuit card elastomeric cable connector assembly'19954,941,830'Edge design for printed circuit board connector'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–1999Patents assigned to IBM (5)· patent assignee history
1990–2000Based in Hyde Park, NY, US· patent location history
1999Patents assigned to BERG ELECTRONICS INC (1)· patent assignee history
2000Patents assigned to C & M CORP (1)· patent assignee history
2000Patents assigned to C & M TECHNOLOGIES GROUP INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 5 | 1990–1999 |
| BERG ELECTRONICS INC | 1 | 1999 |
| C & M CORP | 1 | 2000 |
| C & M TECHNOLOGIES GROUP INC | 1 | 2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hyde Park, New York, US | 7 | 1990–2000 |