LexDanaLexDanabeta
Inventor

Asao Nishimura

Inventor
Kokubunji, JP

Overview

144→
Patents
1988–2014
Patent span
Electricity
Primary field (CPC H)

Patents· 144 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10DInorganic electric semiconductor devices13%
H05KPrinted circuits11%
Y10TTechnical subjects covered by former us classification8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
Y02PClimate change mitigation technologies in the production or processing of goods4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
B23KSoldering or unsoldering2%
H10BElectronic memory devices2%
G01RMeasuring electric variables2%
PatentTitleYear
8,907,475'Pb-free solder-connected structure'20148,629,481'Semiconductor integrated circuit device'20148,503,189'Pb-free solder-connected structure and electronic device'20137,910,960'Semiconductor integrated circuit device with a fuse circuit'20117,910,922'Semiconductor integrated circuit device and manufacture thereof'20117,709,746'Pb-free solder-connected structure and electronic device'20107,550,763'Semiconductor integrated circuit device and manufacture thereof'20097,420,284'Semiconductor device and manufacturing method thereof'20087,388,295'Multi-chip module'20087,378,333'Semiconductor device and manufacturing method thereof'20087,247,879'Semiconductor integrated circuit device having particular testing pad arrangement'20077,217,992'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'20077,138,722'Semiconductor device'20067,119,446'Semiconductor device'20067,102,221'Memory-Module with an increased density for mounting semiconductor chips'20067,091,620'Semiconductor device and manufacturing method thereof'20067,057,283'Semiconductor device and method for producing the same'20067,038,322'Multi-chip module'20067,038,325'Wiring tape for semiconductor device including a buffer layer having interconnected foams'20067,030,478'Semiconductor device'20067,013,564'Method of producing an electronic device having a PB free solder connection'20066,960,396'Pb-free solder-connected structure and electronic device'20056,949,416'Method of manufacturing a semiconductor integrated circuit device'20056,946,327'Semiconductor device and manufacturing method of that'20056,946,723'Semiconductor device and manufacturing method thereof'20056,940,162'Semiconductor module and mounting method for same'20056,930,388'Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure'20056,927,489'Semiconductor device provided with rewiring layer'20056,919,622'Semiconductor device'20056,900,074'METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING PLURAL SEMICONDUCTOR CHIPS, WHEREIN ELECTRODES OF THE SEMICONDUCTOR CHIPS ARE ELECTRICALLY CONNECTED TOGETHER VIA WIRING SUBSTRATES OF THE SEMICONDUCTOR CHIPS'20056,888,230'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'20056,882,039'Semiconductor device'20056,869,008'Method of forming bumps'20056,861,742'Wafer level chip size package having rerouting layers'20056,844,219'Semiconductor device and lead frame therefor'20056,831,294'Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes'20046,822,317'Semiconductor apparatus including insulating layer having a protrusive portion'20046,798,072'Flip chip assembly structure for semiconductor device and method of assembling therefor'20046,784,533'Semiconductor device'20046,784,554'Semiconductor device and manufacturing method thereof'20046,784,541'Semiconductor module and mounting method for same'20046,777,816'Multi-chip module'20046,770,547'Method for producing a semiconductor device'20046,720,591'Semiconductor integrated circuit device'20046,720,208'Semiconductor device'20046,710,446'Semiconductor device comprising stress relaxation layers and method for manufacturing the same'20046,696,765'Multi-chip module'20046,670,215'Semiconductor device and manufacturing method thereof'20036,664,135'Method of manufacturing a ball grid array type semiconductor package'20036,642,083'Semiconductor device and manufacturing method thereof'20036,639,323'Semiconductor device and its manufacturing method'20036,630,731'Semiconductor device'20036,627,997'Semiconductor module and method of mounting'20036,624,504'Semiconductor device and method for manufacturing the same'20036,621,154'Semiconductor apparatus having stress cushioning layer'20036,611,012'Semiconductor device'20036,559,037'Process for producing semiconductor device having crystallized film formed from deposited amorphous film'20036,531,785'Semiconductor device'20036,531,760'Semiconductor device'20036,521,981'Semiconductor device and manufacturing method thereof'20036,515,371'Semiconductor device with elastic structure and wiring'20036,492,719'Semiconductor device'20026,472,727'Semiconductor device and manufacturing method thereof'20026,465,876'Semiconductor device and lead frame therefor'20026,433,440'Semiconductor device having a porous buffer layer for semiconductor device'20026,413,850'Method of forming bumps'20026,402,014'Method of forming bumps'20026,396,145'Semiconductor device and method for manufacturing the same technical field'2002RE037690'Lead frame and semiconductor device'20026,365,439'Method of manufacturing a ball grid array type semiconductor package'20026,355,975'Semiconductor device and manufacturing method thereof'20026,355,500'Semiconductor device and manufacturing method thereof'20026,353,255'Semiconductor device and manufacturing method thereof'20026,348,741'Semiconductor apparatus and a manufacturing method thereof'20026,342,728'Semiconductor device and manufacturing method thereof'20026,342,726'Semiconductor device and manufacturing method thereof'20026,335,565'Semiconductor device'20026,326,699'Semiconductor device'20016,326,681'Semiconductor device'20016,326,284'Semiconductor device and production thereof'20016,314,819'Method for measuring adhesion strength of resin material'20016,307,269'Semiconductor device with chip size package'20016,303,982'Semiconductor device'20016,297,544'Semiconductor device and method for manufacturing the same'20016,297,073'Semiconductor device'20016,213,386'Method of forming bumps'20016,211,576'Semiconductor device'20016,204,552'Semiconductor device'20016,204,155'Semiconductor device and production thereof'20016,187,100'Semiconductor device and production thereof'20016,130,112'Semiconductor device'20006,130,114'Semiconductor device'20006,124,629'Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip'20006,100,115'Semiconductor device'20006,100,580'Semiconductor device having all outer leads extending from one side of a resin member'20006,097,100'Resin sealed semiconductor devices and a process for manufacturing the same'20006,081,023'Semiconductor device'20006,080,611'Semiconductor device and production thereof'20006,070,473'Method for measuring adhesion strength of resin material'20006,072,231'Semiconductor device'20006,069,029'Semiconductor device chip on lead and lead on chip manufacturing'20006,064,112'Resin-molded semiconductor device having a lead on chip structure'20006,049,128'Semiconductor device'20006,018,191'Semiconductor device'20005,981,315'Semiconductor device'19995,914,530'Semiconductor device'19995,895,965'Semiconductor device'19995,863,817'Semiconductor device'19995,821,606'Semiconductor device'19985,793,099'Semiconductor device'19985,698,790'Method for measuring adhesion strength of resin material'19975,670,793'Semiconductor device having a polycrystalline silicon film with crystal grains having a uniform orientation'19975,643,805'Process for producing a bipolar device'19975,635,756'Semiconductor device, lead frame therefor and memory card to provide a thin structure'19975,619,069'Bipolar device and production thereof'19975,612,569'Semiconductor device'19975,608,265'Encapsulated semiconductor device package having holes for electrically conductive material'19975,571,428'Semiconductor leadframe and its production method and plastic encapsulated semiconductor device'19965,539,250'Plastic-molded-type semiconductor device'19965,537,884'Method for measuring adhesion strength of resin material'19965,530,286'Semiconductor device'19965,488,254'Plastic-molded-type semiconductor device'19965,437,915'Semiconductor leadframe and its production method and plastic encapsulated semiconductor device'19955,391,916'Resin sealed type semiconductor device'19955,359,899'Method for measuring adhesion strength of resin material'19945,358,904'Semiconductor device'19945,357,139'Plastic encapsulated semiconductor device and lead frame'19945,347,429'Plastic-molded-type semiconductor device'19945,299,092'Plastic sealed type semiconductor apparatus'19945,296,737'Semiconductor device with a plurality of face to face chips'19945,295,045'Plastic-molded-type semiconductor device and producing method therefor'19945,293,068'Semiconductor device'19945,287,284'Product specification complex analysis system'19945,256,903'Plastic encapsulated semiconductor device'19935,194,935'Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure'19935,159,434'Semiconductor device having a particular chip pad structure'19925,110,537'Water quality inspection method and apparatus therefor'19925,101,263'Semiconductor device and method for manufacturing the same'19925,068,712'Semiconductor device'19915,047,837'Semiconductor device with heat transfer cap'19915,041,901'Lead frame and semiconductor device using the same'19914,987,474'Semiconductor device and method of manufacturing the same'19914,942,452'Lead frame and semiconductor device'19904,739,381'Piezoresistive strain sensing device'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–2006Patents assigned to HITACHI LTD (106)· patent assignee history
1990–2005Based in Ushiku, JP· patent location history
1997–2014Based in Kokubunji, JP· patent location history
2001–2003Patents assigned to HITACHI ULSI SYS CO LTD (5)· patent assignee history
2001–2003Patents assigned to AKITA ELECTRONICS CO LTD (3)· patent assignee history
2003–2010Patents assigned to RENESAS TECH CORP (31)· patent assignee history
2003–2006Based in Tokyo, JP· patent location history
2004–2008Based in Koganei, JP· patent location history
2005Based in Kokubuji, JP· patent location history
2011–2014Patents assigned to RENESAS ELECTRONICS CORP (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI LTD1061988–2006
RENESAS TECH CORP312003–2010
HITACHI ULSI SYS CO LTD52001–2003
RENESAS ELECTRONICS CORP52011–2014
AKITA ELECTRONICS CO LTD32001–2003
Locations
LocationPatentsSpan
Kokubunji, JP721997–2014
Ushiku, JP541990–2005
Koganei, JP102004–2008
Tokyo, JP42003–2006
Kokubuji, JP12005