Inventor
Hayato Takakura
Inventor
Osaka, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits40%
H04NPictorial communication, e.g. television13%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation13%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
H01LSemiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
11,122,676Flexible wiring circuit board and imaging device202111,081,437Imaging element mounting board, producing method of imaging element mounting board, and mounting board assembly202111,058,002Method of producing a wired circuit board202111,032,913Wired circuit board and production method thereof202110,813,221Flexible wiring circuit board, producing method thereof, and imaging device20209,173,301'Printed circuit board and method of manufacturing same'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2021Patents assigned to NITTO DENKO CORP (6)· patent assignee history
2015Based in Ibaraki, JP· patent location history
2020–2021Based in Osaka, JP· patent location history
2021Based in Osaka-shi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 6 | 2015–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 3 | 2020–2021 |
| Osaka-shi, JP | 2 | 2021 |
| Ibaraki, JP | 1 | 2015 |