Inventor
Takahiko Matsushita
Inventor
Hadano, JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,518,233'Sealing structure for multi-chip module'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009Patents assigned to HITACHI INFORMATION TECHNOLOGY (1)· patent assignee history
2009Patents assigned to HITACHI LTD (1)· patent assignee history
2009Based in Hadano, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI INFORMATION TECHNOLOGY | 1 | 2009 |
| HITACHI LTD | 1 | 2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hadano, JP | 1 | 2009 |