Inventor

Byung Ho Kim

Inventor
Suwon-si, KR

Overview

22→
Patents
2009–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01LSemiconductor devices15%
G06FElectric digital data processing6%
G11CStatic stores6%
H01PWaveguides6%
H01QAntennas, i.e. radio aerials6%
H04NPictorial communication, e.g. television6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
G02BOptical elements, systems or apparatus4%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them4%
PatentTitleYear
10,872,863Semiconductor package202010,824,580Semiconductor device202010,770,416Semiconductor package202010,741,448Method of singulating semiconductor die and method of fabricating semiconductor package202010,622,273Semiconductor package with improved flatness of an insulating layer formed on patterns202010,515,916Fan-out semiconductor package201910,491,826Method for obtaining panning shot image and electronic device supporting the same201910,402,620Fan-out semiconductor package201910,389,951Method for processing image and electronic device supporting the same201910,157,868Fan-out semiconductor package201810,095,411Controllers including separate input-output circuits for mapping table and buffer memory, solid state drives including the controllers, and computing systems including the solid state drives201810,090,835On-die termination circuit, a memory device including the on-die termination circuit, and a memory system including the memory device201810,078,198Photographing apparatus for automatically determining a focus area and a control method thereof201810,008,398Substrate thinning apparatus, method of thinning substrate by using the same, and method of fabricating semiconductor package20189,811,265'Buffer memory devices, memory modules and solid state disks with non-uniform memory device connections'20178,952,865'Antenna and transformer included in the same'20158,952,866'Dove tail device in an antenna'20158,841,977'Phase shifter for producing different phase shifts through different phase velocities in different lines'20148,418,532'Steam generator for sodium cooled fast reactor, heat transfer tubes thereof, and leak detection unit for heat transfer tube thereof'20137,713,830'Method of forming poly pattern in R-string of LCD drive IC and structure of the same'20107,595,254'Method of manufacturing a semiconductor device'20097,589,011'Semiconductor device and method of forming intermetal dielectric layer'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2010Patents assigned to DONGBU HITEK CO LTD (3)· patent assignee history
2009–2019Based in Seoul, KR· patent location history
2010Based in Gangnam-gu, KR· patent location history
2013–2015Patents assigned to KIM BYUNG-HO (4)· patent assignee history
2013Based in Daejeon, KR· patent location history
2014–2015Patents assigned to Ace tech corp (3)· patent assignee history
2015Patents assigned to OH GUN-SEOK (2)· patent assignee history
2017–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (14)· patent assignee history
2017–2020Based in Suwon-si, KR· patent location history
2018–2020Based in Cheonan-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRONICS CO LTD142017–2020
KIM BYUNG-HOself42013–2015
Ace tech corp32014–2015
DONGBU HITEK CO LTD32009–2010
OH GUN-SEOK22015
Locations
LocationPatentsSpan
Suwon-si, KR102017–2020
Seoul, KR82009–2019
Cheonan-si, KR22018–2020
Daejeon, KR12013
Gangnam-gu, KR12010