Inventor
Hyun-Mo Ku
Inventor
Seoul, KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices24%
Y02PClimate change mitigation technologies in the production or processing of goods12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
9,972,592Bumped land grid array20189,972,590Semiconductor package having a solder-on-pad structure20189,974,181Module with external shield and back-spill barrier for protecting contact pads20189,907,169'Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB'20189,693,445'Printed circuit board with thermal via'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2018Patents assigned to AVAGO TECHNOLOGIES GENERAL IP (5)· patent assignee history
2017–2018Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVAGO TECHNOLOGIES GENERAL IP | 5 | 2017–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 5 | 2017–2018 |