LexDanaLexDanabeta
Inventor

Yuuji Suzuki

Inventor
Tochigi, JP

Overview

24→
Patents
1988–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits19%
Y10TTechnical subjects covered by former us classification16%
C25DProcesses for the electrolytic or electrophoretic production of coatings14%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
B31FMechanical working or deformation of paper, cardboard or material worked in a manner analogous to paper3%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
A61HPhysical therapy apparatus, e.g. devices for locating or stimulating reflex points in the body1%
B25JManipulators1%
B41JTypewriters1%
PatentTitleYear
10,999,095Communication method202110,518,938Container201910,160,119Robot system20189,102,117'Sheet processing apparatus, image forming system, and sheet folding method'20159,078,341'Display device'20159,016,679'Sheet processing apparatus and image forming system'20158,153,273'Surface treated electrodeposited copper foil and circuit board'20127,985,488'Ultrathin copper foil with carrier and printed circuit board using same'20117,985,485'Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil'20117,976,956'Laminated circuit board'20117,892,655'Ultrathin copper foil with carrier and printed circuit board using same'20117,794,578'Method for preparing a circuit board material having a conductive base and a resistance layer'20107,771,841'Ultrathin copper foil with carrier and printed circuit board using same'20107,381,475'Treated copper foil and circuit board'20087,275,795'Braking system of hybrid vehicle'20077,223,481'Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board'20077,215,235'Conductive substrate with resistance layer, resistance board, and resistance circuit board'20077,078,928'Semiconductor integrated circuit device'20066,944,280'Gateway system having a redundant structure of media gateway controllers'20056,939,400'Ink, production method of the same materials for producing the same and printed matter with the same'20056,924,043'Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier'20056,312,400'Air expandable bodies reciprocating a massage element'20015,614,328'Reflow-plated member and a manufacturing method therefor'19974,725,860'Ink carrier film in use with ink jet recording device'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2012Patents assigned to FURUKAWA ELECTRIC CO LTD (8)· patent assignee history
1997–2019Based in Tokyo, JP· patent location history
2001–2015Based in Kanagawa, JP· patent location history
2005–2012Based in Tochigi, JP· patent location history
2007–2008Patents assigned to FURUKAWA CIRCUIT FOIL (2)· patent assignee history
2012–2015Patents assigned to SUZUKI YUUJI (3)· patent assignee history
2015Patents assigned to FURUHASHI TOMOHIRO (2)· patent assignee history
2015Patents assigned to GOTO KIICHIRO (2)· patent assignee history
2018Based in Yamanashi, JP· patent location history
2021Based in Toyota, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FURUKAWA ELECTRIC CO LTD81997–2012
SUZUKI YUUJIself32012–2015
FURUHASHI TOMOHIRO22015
FURUKAWA CIRCUIT FOIL22007–2008
GOTO KIICHIRO22015
Locations
LocationPatentsSpan
Tochigi, JP82005–2012
Tokyo, JP51997–2019
Kanagawa, JP32001–2015
Toyota, JP12021
Yamanashi, JP12018