LexDanaLexDanabeta
Inventor

Aiping TAN

Inventor
CN

Overview

3→
Patents
2022–2023
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
G11CStatic stores13%
H10BElectronic memory devices13%
PatentTitleYear
11,848,281Die stack with reduced warpage202311,652,087Interposer design in package structures for wire bonding applications202311,538,746Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to INTEL CORP (2)· patent assignee history
2022–2023Based in CN· patent location history
2023Patents assigned to TAHOE RES LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP22022–2023
TAHOE RES LTD12023
Locations
LocationPatentsSpan
CN32022–2023