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Inventor

Wen-Fu Chou

Inventor
Kaohsiung, TW

Overview

3→
Patents
2013–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01PWaveguides17%
Y02PClimate change mitigation technologies in the production or processing of goods17%
PatentTitleYear
10,999,928Circuit board202110,993,319Chip package and circuit board thereof20218,384,492'Coaxial line to microstrip connector having slots in the microstrip line for receiving an encircling metallic plate'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013Patents assigned to CHENG JUI-CHING (1)· patent assignee history
2013Patents assigned to CHOU WEN-FU (1)· patent assignee history
2013Patents assigned to HUANG KUAN-LIN (1)· patent assignee history
2013Patents assigned to LI ERIC S (1)· patent assignee history
2013Based in Taipei, TW· patent location history
2021Patents assigned to CHIPBOND TECHNOLOGY CORP (2)· patent assignee history
2021Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP22021
CHENG JUI-CHING12013
CHOU WEN-FUself12013
HUANG KUAN-LIN12013
LI ERIC S12013
Locations
LocationPatentsSpan
Kaohsiung, TW22021
Taipei, TW12013