Inventor

YOSHIHITO OTSUBO

Inventor

Overview

52→

Patents

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 52 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%

H05KPrinted circuits33%

H01LSemiconductor devices21%

H01FMagnets7%

H01GCapacitors2%

H01QAntennas, i.e. radio aerials2%

H01RElectrically-conductive connections1%

H03FAmplifiers1%

H03HImpedance networks, e.g. resonant circuits1%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h101%

PatentTitleYear

12,568,583Circuit module2026 12,495,485Module and component2025 12,495,501Module2025 12,484,146Structure body and method of manufacturing the same2025 12,446,159Electronic circuit module2025 12,446,157Module2025 12,432,858Module and method for manufacturing same2025 12,424,528Module2025 12,414,225Circuit module2025 12,401,142Circuit module2025 12,389,528Module2025 12,309,932Electronic component module, sub-module, and method for manufacturing same2025 12,309,913Module2025 12,293,975High-frequency module having a compartment shield structure2025 12,279,374Circuit module and method for manufacturing submodule2025 12,255,151Module2025 12,207,390Module2025 12,205,862Module2025 12,193,148Module2025 12,193,144Module2025 12,193,162Module2025 12,177,976Module2024 12,144,159Module2024 12,113,030Electronic component module comprising shield and sealing resin covering electronic components2024 12,016,112Electronic module2024 11,961,830Module2024 11,804,448Module2023 11,769,623Coil component2023 11,716,813Module2023 11,699,670High-frequency module2023 11,659,659Ceramic electronic component2023 11,646,273Module2023 11,602,089High-frequency module2023 11,476,172Radio frequency module2022 11,469,020Coil component2022 11,430,601Coil component2022 11,419,215Module2022 11,373,796Inductor component and method for manufacturing inductor component2022 11,348,894High-frequency module2022 11,335,645High-frequency module and manufacturing method thereof2022 11,322,472Module2022 11,302,606High-frequency module2022 11,297,746High-frequency module2022 11,291,108Radio-frequency module with shield wall2022 11,264,366Module2022 11,239,022Inductor component manufacturing method and inductor component2022 11,227,840Electronic module having improved shield performance2022 11,183,465Radio-frequency module2021 11,177,189Module including heat dissipation structure2021 11,164,695Inductor component2021 11,152,157Stacked electronic component and method for manufacturing stacked electronic component2021 11,139,101Coil component2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to MURATA MANUFACTURING CO (52)· patent assignee history

2021–2026Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MURATA MANUFACTURING CO	52	2021–2026

Locations

Location	Patents	Span
JP	52	2021–2026