Inventor
Shuichi Oka
Inventor
Kanagawa, JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H01LSemiconductor devices16%
H05KPrinted circuits8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation8%
G02BOptical elements, systems or apparatus7%
G06VImage or video recognition or understanding5%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light5%
Y10TTechnical subjects covered by former us classification5%
H04QSelecting4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
10,830,972Optical connector, electronic apparatus and optical interconnection system202010,634,862Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system202010,483,413Photoelectric module and optical device201910,410,884Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate201910,168,498Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system201910,134,662Mounting substrate and method of manufacturing the same201810,109,571Wiring substrate and manufacturing method of wiring substrate20189,929,199'Radiation detector, imaging unit, and imaging and display system'20189,723,724'Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate'20179,672,983'Peel resistant multilayer wiring board with thin film capacitor and manufacturing method thereof'20179,614,347'Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system'20179,257,395'Semiconductor device'20168,482,107'Circular shield of a circuit-substrate laminated module and electronic apparatus'20138,338,912'Inductor module, silicon tuner module and semiconductor device'20128,331,103'Wiring board, method of manufacturing same, tuner module, and electronic device'20128,254,144'Circuit board laminated module and electronic equipment'20127,889,027'Film bulk acoustic resonator shaped as an ellipse with a part cut off'20117,629,200'Fingerprint detection device and method of its manufacture, and apparatus for forming a protective film'20097,250,774'Fingerprint sensor'20077,235,853'Fingerprint detection device and method of its manufacture, and apparatus for forming a protective film'20076,960,790'Fingerprint detection device and method of its manufacture, and apparatus for forming a protective film'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2020Patents assigned to SONY CORP (21)· patent assignee history
2005–2020Based in Kanagawa, JP· patent location history
2012–2017Patents assigned to OKA SHUICHI (5)· patent assignee history
2012–2017Patents assigned to YANAGAWA SHUSAKU (4)· patent assignee history
2012–2013Patents assigned to MATSUMOTO KATSUJI (3)· patent assignee history
2012–2013Patents assigned to ROKUHARA SHINJI (2)· patent assignee history
2018Based in Minato-ku, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 21 | 2005–2020 |
| OKA SHUICHIself | 5 | 2012–2017 |
| YANAGAWA SHUSAKU | 4 | 2012–2017 |
| MATSUMOTO KATSUJI | 3 | 2012–2013 |
| ROKUHARA SHINJI | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 20 | 2005–2020 |
| Minato-ku, JP | 1 | 2018 |