Inventor
Nicholas HAEHN
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
G06TImage data processing or generation, in general6%
H05KPrinted circuits6%
PatentTitleYear
12,400,363Device and method for improved fiducial marker detection202512,068,222Dummy die structures of a packaged integrated circuit device202411,652,036Via-trace structures202311,640,929Thermal management solutions for cored substrates202311,594,463Substrate thermal layer for heat spreader connection202311,528,811Method, device and system for providing etched metallization structures2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (6)· patent assignee history
2022–2025Based in US· patent location history
2023Patents assigned to Santa Clara (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2022–2025 |
| Santa Clara | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2025 |