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Inventor

Hisashi Terashita

Inventor
Mitaka, JP

Overview

5→
Patents
1999–2015
Patent span
Performing operations
Primary field (CPC B)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing57%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure14%
PatentTitleYear
9,003,889'Resonant pressure sensor and method of manufacturing the same'20156,203,414'Polishing apparatus'20016,080,049'Wafer polishing apparatus'20006,027,398'Wafer polishing apparatus'20005,931,725'Wafer polishing machine'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2001Patents assigned to TOKYO SEIMITSU CO LTD (4)· patent assignee history
1999–2001Based in Mitaka, JP· patent location history
2015Patents assigned to SUZUKI HIROSHI (1)· patent assignee history
2015Patents assigned to TERASHITA HISASHI (1)· patent assignee history
2015Patents assigned to YOKOGAWA ELECTRIC CORP (1)· patent assignee history
2015Patents assigned to YOSHIDA TAKASHI (1)· patent assignee history
2015Based in Musashino, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOKYO SEIMITSU CO LTD41999–2001
SUZUKI HIROSHI12015
TERASHITA HISASHIself12015
YOKOGAWA ELECTRIC CORP12015
YOSHIDA TAKASHI12015
Locations
LocationPatentsSpan
Mitaka, JP41999–2001
Musashino, JP12015