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Inventor

Yong Kee Yeo

Inventor
Singapore, SG

Overview

4→
Patents
2003–2004
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
H01RElectrically-conductive connections20%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light20%
PatentTitleYear
6,710,438'Enhanced chip scale package for wire bond dies'20046,617,667'Optical device carrier'20036,608,379'Enhanced chip scale package for flip chips'20036,599,138'High frequency board-to-board connector'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2004Patents assigned to INST OF MICROELECTRONICS (4)· patent assignee history
2003–2004Based in Singapore, SG· patent location history
2004Patents assigned to ADVANCED MICRO DEVICES S PTE L (1)· patent assignee history
2004Patents assigned to AGERE SYSTEMS SINGAPORE PTE LT (1)· patent assignee history
2004Patents assigned to AGILENT TECHNOLOGIES SINGAPORE (1)· patent assignee history
2004Patents assigned to AMKOR TECHNOLOGY INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INST OF MICROELECTRONICS42003–2004
ADVANCED MICRO DEVICES S PTE L12004
AGERE SYSTEMS SINGAPORE PTE LT12004
AGILENT TECHNOLOGIES SINGAPORE12004
AMKOR TECHNOLOGY INC12004
Locations
LocationPatentsSpan
Singapore, SG42003–2004