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Inventor

Nai-Hao Kao

Inventor
Taichung, TW

Overview

2→
Patents
2004–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
8,207,620'Flip-chip semiconductor package and chip carrier for preventing corner delamination'20126,819,565'Cavity-down ball grid array semiconductor package with heat spreader'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2012Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (2)· patent assignee history
2004–2012Based in Taichung, TW· patent location history
2012Patents assigned to HSIAO CHENG-HSU (1)· patent assignee history
2012Patents assigned to KAO NAI-HAO (1)· patent assignee history
2012Patents assigned to LAI JENG-YUAN (1)· patent assignee history
2012Patents assigned to TZENG YUAN-LIN (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SILICONWARE PRECISION INDUSTRIES CO LTD22004–2012
HSIAO CHENG-HSU12012
KAO NAI-HAOself12012
LAI JENG-YUAN12012
TZENG YUAN-LIN12012
Locations
LocationPatentsSpan
Taichung, TW22004–2012