Inventor
YIAN-LIANG KUO
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10DInorganic electric semiconductor devices22%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation13%
G01RMeasuring electric variables4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
12,431,366Structure having thermal dissipation structure therein and manufacturing method thereof202512,159,862Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices202411,996,368Pad structure for enhanced bondability202411,959,958Method of analyzing semiconductor structure202411,935,760Package structure having thermal dissipation structure therein and manufacturing method thereof202411,728,279Pad structure for enhanced bondability202311,227,836Pad structure for enhanced bondability2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2025 |