Inventor

GARRY D. HINCH

Inventor
US

Overview

2→
Patents
2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary
B22FWorking metallic powder14%
B29CShaping or joining of plastics14%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts14%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering14%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients14%
C08LCompositions of macromolecular compounds14%
Y02PClimate change mitigation technologies in the production or processing of goods14%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history
2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO22024
Locations
LocationPatentsSpan
US22024