Inventor
Lei Shi
Inventor
Beijing, CN
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B01Dprimary
B01DSeparation13%
B29CShaping or joining of plastics13%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts13%
B29LIndexing scheme associated with subclass b29c, relating to particular articles13%
C02FTreatment of water, waste water, sewage, or sludge13%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds13%
G06FElectric digital data processing13%
LOC0213%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017Patents assigned to INTEL CORP (1)· patent assignee history
2017–2020Based in Beijing, CN· patent location history
2020Patents assigned to BEIJING XIAOMI MOBILE SOFTWARE CO LTD (1)· patent assignee history
2020Patents assigned to EVOQUA WATER TECH PTE LTD (1)· patent assignee history
2020Patents assigned to TRIOS DONGGUAN TECH CO LTD (1)· patent assignee history
2020Patents assigned to UNIV NANYANG TECH (1)· patent assignee history
2020Based in Singapore, SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BEIJING XIAOMI MOBILE SOFTWARE CO LTD | 1 | 2020 |
| EVOQUA WATER TECH PTE LTD | 1 | 2020 |
| INTEL CORP | 1 | 2017 |
| TRIOS DONGGUAN TECH CO LTD | 1 | 2020 |
| UNIV NANYANG TECH | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beijing, CN | 2 | 2017–2020 |
| Singapore, SG | 1 | 2020 |