Inventor
Sidney J. Clouser
Inventor
Chardon, OH, US
Overview
20→
Patents
1991–2004
Patent span
General tagging of new technological developments
Primary field (CPC Y)
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification23%
C25DProcesses for the electrolytic or electrophoretic production of coatings20%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
H01CResistors6%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
C22BProduction and refining of metals2%
C23CCoating metallic material2%
C23FNon-mechanical removal of metallic material from surface2%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy2%
PatentTitleYear
6,824,880'Process for improving adhesion of resistive foil to laminating materials'20046,805,964'Protective coatings for improved tarnish resistance in metal foils'20046,771,160'Resistor component with multiple layers of resistive material'20046,770,976'Process for manufacturing copper foil on a metal carrier substrate'20046,622,374'Resistor component with multiple layers of resistive material'20036,537,675'Protective coatings for improved tarnish resistance in metal foils'20036,447,929'Thin copper on usable carrier and method of forming same'20026,183,607'Anode structure for manufacture of metallic foil'20016,132,887'High fatigue ductility electrodeposited copper foil'20006,123,788'Copper wire and process for making copper wire'20005,863,666'High performance flexible laminate'19995,830,583'Copper wire'19985,454,926'Electrodeposited copper foil'19955,421,985'Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations'19955,403,465'Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives'19955,366,612'Process for making copper foil'19945,243,320'Resistive metal layers and method for making same'19935,215,645'Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same'19935,171,417'Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same'19925,017,271'Method for printed circuit board pattern making using selectively etchable metal layers'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–1995Patents assigned to GOULD INC (6)· patent assignee history
1991–2004Based in Chardon, OH, US· patent location history
1994–2003Patents assigned to GOULD ELECTRONICS INC (6)· patent assignee history
2000Patents assigned to ELECTROCOPPER PROD LTD (1)· patent assignee history
2001–2004Patents assigned to GA TEK INC (3)· patent assignee history
2004Patents assigned to NIKKO MATERIALS USA INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GOULD ELECTRONICS INC | 6 | 1994–2003 |
| GOULD INC | 6 | 1991–1995 |
| GA TEK INC | 3 | 2001–2004 |
| NIKKO MATERIALS USA INC | 3 | 2004 |
| ELECTROCOPPER PROD LTD | 1 | 2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chardon, OH, US | 20 | 1991–2004 |