LexDanaLexDanabeta
Inventor

William D. Weber

Inventor
Rumford, RI, US

Overview

24→
Patents
1986–2021
Patent span
Physics
Primary field (CPC G)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices35%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds19%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
C08LCompositions of macromolecular compounds4%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms4%
Y10TTechnical subjects covered by former us classification4%
B41MPrinting, duplicating, marking, or copying processes2%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium2%
C11DDetergent compositions2%
PatentTitleYear
11,112,617Luminaire20219,519,216'Positive photosensitive resin compositions'20167,803,510'Positive photosensitive polybenzoxazole precursor compositions'20107,449,280'Photoimageable coating composition and composite article thereof'20087,335,319'Semiconductor stress buffer coating edge bead removal compositions and method for their use'20087,282,324'Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them'20077,195,849'Photosensitive resin compositions'20077,132,205'Positive photosensitive resin compositions'20067,129,011'Photosensitive resin compositions'20067,056,641'Photosensitive resin compositions'20067,018,776'Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems'20066,939,659'Photosensitive resin compositions'20056,929,891'Photosensitive resin compositions'20056,511,789'Photosensitive polyimide precursor compositions'20036,214,516'Photosensitive resin compositions'20016,177,225'Photosensitive resin compositions'20016,143,467'Photosensitive polybenzoxazole precursor compositions'20006,127,086'Photosensitive resin compositions'20005,834,581'Process for making polyimide-polyamic ester copolymers'19985,789,524'Chemical imidization reagent for polyimide synthesis'19985,789,525'Process for making polyimides from diamines and tetracarboxylic diacid diester'19985,582,982'Background-reducing compounds for probe-mediated fluorimetric flow cytometric assays'19965,521,061'Enhancement of probe signal in nucleic acid-mediated in-situ hybridization studies'19964,596,733'Electroerosion recording material with polyorganosiloxane overlayer'1986

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996Patents assigned to APROGENEX INC (2)· patent assignee history
1996Based in Bellaire, TX, US· patent location history
1998Patents assigned to OLIN MICROELECTRONIC CHEM INC (3)· patent assignee history
1998–2003Based in Cranston, RI, US· patent location history
2000–2008Patents assigned to ARCH SPEC CHEM INC (13)· patent assignee history
2005–2008Based in Rumford, RI, US· patent location history
2007–2016Based in East Providence, RI, US· patent location history
2010Patents assigned to FUJIFILM ELECTRONIC MATERIALS (1)· patent assignee history
2016Patents assigned to FUJIFILM ELECTRONIC MAT USA INC (1)· patent assignee history
2021Based in Olivebridge, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ARCH SPEC CHEM INC132000–2008
OLIN MICROELECTRONIC CHEM INC31998
APROGENEX INC21996
FUJIFILM ELECTRONIC MAT USA INC12016
FUJIFILM ELECTRONIC MATERIALS12010
Locations
LocationPatentsSpan
Rumford, RI, US92005–2008
Cranston, RI, US81998–2003
East Providence, RI, US32007–2016
Bellaire, Texas, US21996
Olivebridge, New York, US12021