Inventor
John E. Schmiesing
Inventor
Tempe, AZ, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Pprimary
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock25%
H10DInorganic electric semiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests17%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
6,472,243'Method of forming an integrated CMOS capacitive pressure sensor'20026,318,174'Sensor and method of use'20016,105,428'Sensor and method of use'20005,545,912'Electronic device enclosure including a conductive cap and substrate'19965,164,326'Complementary bipolar and CMOS on SOI'19924,693,781'Trench formation process'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2002Patents assigned to MOTOROLA INC (6)· patent assignee history
1987Based in Round Rock, TX, US· patent location history
1992–2002Based in Tempe, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 6 | 1987–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tempe, AZ, US | 5 | 1992–2002 |
| Round Rock, Texas, US | 1 | 1987 |