Inventor

JUAN BOON TAN

Inventor
SG

Overview

37→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 37 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices24%
H10NElectric solid-state devices not otherwise provided for22%
H10BElectronic memory devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H10DInorganic electric semiconductor devices7%
G11CStatic stores6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
H01GCapacitors1%
H10KOrganic electric solid-state devices1%
PatentTitleYear
12,568,631Three terminal memory cells and method of making the same202612,557,563Layer stacks for a resistive memory element202612,550,723Structure for capacitor having defect-preventing regions in metal electrode202612,484,234Resistive random-access memory elements with lateral sidewall switching202512,388,006Capacitor and airgap structure202512,284,924Programmable interposer using RRAM platform202512,159,848Method of forming a sensor device having moisture sensitive dielectric layer with integrally formed projections202412,102,020Semiconductor memory devices having an electrode with an extension202412,094,763Metal-insulator-metal capacitor (MIMCAP) and methods of forming the same202412,034,039Three electrode capacitor structure using spaced conductive pillars202412,009,326SRAM bit cells with three-dimensional integration202411,978,510Memory devices and methods of forming the same202411,855,019Method of forming a sensor device202311,856,875Memory devices and methods for fabricating memory devices202311,832,538Resistive memory elements with an embedded heating electrode202311,818,969Memory devices and method of forming the same202311,791,379Galvanic isolation using isolation break between redistribution layer electrodes202311,744,085Semiconductor devices and methods of forming semiconductor devices with logic and memory regions insulation layers202311,716,914Non-volatile memory device with filament confinement202311,690,306Correlated electron resistive memory device and integration schemes202311,659,709Single well one transistor and one capacitor nonvolatile memory device and integration schemes202311,646,279Contact pad structures and methods for fabricating contact pad structures202311,641,789Memory cells and methods for forming memory cells202311,552,128Memory device, memory array and method of forming the same202311,522,131Resistive memory device and methods of making such a resistive memory device202211,515,475Resistive random access memory devices202211,515,205Conductive structures for contacting a top electrode of an embedded memory device and methods of making such contact structures on an IC product202211,495,742Dual layer dielectric liner for resistive memory devices202211,482,669Memory device and a method for forming the memory device202211,444,045Bonding structures of semiconductor devices202211,289,649Non-volatile memory elements with a narrowed electrode202211,276,460Dye-sensitized optoelectronic memory202211,270,938Semiconductor devices and methods of forming semiconductor devices202211,244,915Bond pads of semiconductor devices202211,233,195Memory devices and methods of forming memory devices202211,217,496Test pad with crack stop protection202211,205,478Memory device and a method for forming the memory device2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to GLOBALFOUNDRIES SG PTE LTD (36)· patent assignee history
2021–2026Based in SG· patent location history
2022Patents assigned to GLOBALFOUNDRIES US INC (1)· patent assignee history
2024Patents assigned to GLOBALFOUNDRIES SINGAPORE PTD LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GLOBALFOUNDRIES SG PTE LTD362021–2026
GLOBALFOUNDRIES SINGAPORE PTD LTD12024
GLOBALFOUNDRIES US INC12022
Locations
LocationPatentsSpan
SG372021–2026