Inventor

Richard L. Bechtel

Inventor

Sunnyvale, CA, US

Overview

15→

Patents

1989–2002

Patent span

Electricity

Primary field (CPC H)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

G11CStatic stores14%

H10DInorganic electric semiconductor devices14%

Y10TTechnical subjects covered by former us classification10%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact7%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application7%

H05KPrinted circuits7%

E04CStructural elements3%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%

PatentTitleYear

6,483,708'Heatsink apparatus for de-coupling clamping forces on an integrated circuit package'2002 6,459,582'Heatsink apparatus for de-coupling clamping forces on an integrated circuit package'2002 6,150,199'Method for fabrication of programmable interconnect structure'2000 5,989,943'Method for fabrication of programmable interconnect structure'1999 5,780,919'Electrically programmable interconnect structure having a PECVD amorphous silicon element'1998 5,717,230'Field programmable gate array having reproducible metal-to-metal amorphous silicon antifuses'1998 5,691,949'Very high density wafer scale device architecture'1997 5,514,884'Very high density wafer scale device architecture'1996 5,502,315'Electrically programmable interconnect structure having a PECVD amorphous silicon element'1996 5,371,991'Re-bar clamp assembly'1994 5,315,130'Very high density wafer scale device architecture'1994 5,252,507'Very high density wafer scale device architecture'1993 5,223,741'Package for an integrated circuit structure'1993 5,182,632'High density multichip package with interconnect structure and heatsink'1993 4,836,861'Solar cell and cell mount'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–1997Patents assigned to TACTICAL FABS INC (7)· patent assignee history

1989–2002Based in Sunnyvale, CA, US· patent location history

1994Based in San Diego, CA, US· patent location history

1996–2000Patents assigned to QUICKLOGIC CORP (5)· patent assignee history

2002Patents assigned to FUJITSU LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TACTICAL FABS INC	7	1989–1997
QUICKLOGIC CORP	5	1996–2000
FUJITSU LTD	2	2002

Locations

Location	Patents	Span
Sunnyvale, California, US	14	1989–2002
San Diego, California, US	1	1994