Inventor
Tse-Yong Yao
Inventor
San Francisco, CA, US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
C23CCoating metallic material17%
H01JElectric discharge tubes or discharge lamps12%
H10DInorganic electric semiconductor devices10%
C25DProcesses for the electrolytic or electrophoretic production of coatings5%
C11DDetergent compositions2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
6,790,776'Barrier layer for electroplating processes'20046,607,640'Temperature control of a substrate'20036,436,302'Post CU CMP polishing for reduced defects'20026,436,832'Method to reduce polish initiation time in a polish process'20026,328,871'Barrier layer for electroplating processes'20016,313,027'Method for low thermal budget metal filling and planarization of contacts vias and trenches'20016,277,198'Use of tapered shadow clamp ring to provide improved physical vapor deposition system'20016,217,721'Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer'20016,140,235'High pressure copper fill at low temperature'20006,136,095'Apparatus for filling apertures in a film layer on a semiconductor substrate'20006,051,114'Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition'20005,962,923'Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches'19995,847,461'Integrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layer'19985,668,055'Method of filling of contact openings and vias by self-extrusion of overlying compressively stressed matal layer'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2004Patents assigned to APPLIED MATERIALS INC (14)· patent assignee history
1997–2001Based in Sunnyvale, CA, US· patent location history
2000–2004Based in San Francisco, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 14 | 1997–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Francisco, California, US | 7 | 2000–2004 |
| Sunnyvale, California, US | 7 | 1997–2001 |