Inventor

Fumio Aoki

Inventor
Ichihara, JP

Overview

21→
Patents
1977–2014
Patent span
Chemistry
Primary field (CPC C)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification22%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds13%
H05KPrinted circuits12%
C08JWorking-up9%
C08LCompositions of macromolecular compounds7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
H01RElectrically-conductive connections6%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
PatentTitleYear
8,709,205'Polyimide short fibers and heat-resistant paper comprising same'20148,277,605'Thermosetting solution composition and prepreg'20128,179,681'Module structure'20128,117,830'Exhaust purification device for engine'20128,114,317'Polyimide powder for antistatic polyimide molded product and polyimide molded product thereby'20127,985,028'Optical fiber splicing technique and optical member unit'20117,807,014'Thermosetting solution composition and prepreg'20107,754,108'Polyimide powder for antistatic polyimide molded product and polyimide molded product thereby'20107,300,972'Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate'20077,017,259'Housing removal tool'20066,797,392'Polyimide/metal composite sheet'20046,655,990'Method of surface mounting a connector and connector'20036,605,366'Metal film/aromatic polymide film laminate'20036,538,097'Process for production of polyimide powder, polyimide powder, polyimide powder molded bodies and process for their production'20036,534,622'Process for production of polyimide powder, polyimide powder, polyimide powder molded bodies and process for their production'20036,319,597'Polyimide composite film'20016,081,998'Method of surface mounting a connector'20005,898,048'Polyimide powder and process for producing powder molded body'19995,891,986'Aromatic polyimide film and its precursor composition'19995,741,598'Polyimide/metal composite sheet'19984,032,913'Coding equipment providing compressed code'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–2012Based in Yokohama, JP· patent location history
1998–2014Patents assigned to UBE INDUSTRIES (13)· patent assignee history
1998–2012Based in Chiba, JP· patent location history
1999–2014Based in Ichihara, JP· patent location history
2000–2012Patents assigned to FUJITSU LTD (5)· patent assignee history
2000–2012Based in Kawasaki, JP· patent location history
2012–2014Patents assigned to AOKI FUMIO (5)· patent assignee history
2012–2014Patents assigned to OZAWA HIDEKI (2)· patent assignee history
2012Patents assigned to AIZAWA HAYATO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UBE INDUSTRIES131998–2014
AOKI FUMIOself52012–2014
FUJITSU LTD52000–2012
OZAWA HIDEKI22012–2014
AIZAWA HAYATO12012
Locations
LocationPatentsSpan
Ichihara, JP71999–2014
Chiba, JP71998–2012
Kawasaki, JP52000–2012
Yokohama, JP21977–2012