Inventor
DONGBING SHAO
Inventor
US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
G06NComputing arrangements based on specific computational models13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10DInorganic electric semiconductor devices9%
H10NElectric solid-state devices not otherwise provided for7%
H10BElectronic memory devices6%
G06FElectric digital data processing4%
H01PWaveguides3%
B82YSpecific uses or applications of nanostructures1%
PatentTitleYear
12,327,730Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic202512,293,253Multipole filter on a quantum device with multiplexing and signal separation202512,107,065Uniform chip gaps via injection-molded solder pillars202412,039,402Color-map method to eliminate qubit frequency crowding in a quantum computing chip202411,978,639Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic202411,894,303Circuit wiring techniques for stacked transistor structures202411,749,529Self-aligned double patterning with spacer-merge region202311,699,591Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic202311,574,103Addressing layout retargeting shortfalls202311,568,296Highway jumper to enable long range connectivity for superconducting quantum computer chip202311,538,854Coupled-line bus to suppress classical crosstalk for superconducting qubits202211,527,697Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices202211,302,532Self-aligned double patterning with spacer-merge region202211,205,035Bump connection placement in quantum devices in a flip chip configuration202111,195,982Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices202111,195,799Hybrid readout package for quantum multichip bonding202111,189,566Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias202111,163,932Semiconductor process modeling to enable skip via in place and route flow202111,165,248Air gap metal tip electrostatic discharge protection2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to IBM (16)· patent assignee history
2021–2025Based in US· patent location history
2023–2024Patents assigned to TESSERA LLC (2)· patent assignee history
2025Patents assigned to ADEIA SEMICONDUCTOR SOLUTIONS LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 16 | 2021–2025 |
| TESSERA LLC | 2 | 2023–2024 |
| ADEIA SEMICONDUCTOR SOLUTIONS LLC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 19 | 2021–2025 |