Inventor
Taro Arakawa
Inventor
Tokyo, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
B23KSoldering or unsoldering17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
C09JAdhesives8%
H01GCapacitors8%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2020Patents assigned to DISCO CORP (3)· patent assignee history
2016–2020Based in Tokyo, JP· patent location history
2021Patents assigned to MURATA MANUFACTURING CO (1)· patent assignee history
2021Based in Nagaokakyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 3 | 2016–2020 |
| MURATA MANUFACTURING CO | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 3 | 2016–2020 |
| Nagaokakyo, JP | 1 | 2021 |