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Inventor

Sanae Taniguchi

Inventor
Saitama, JP

Overview

3→
Patents
2001–2007
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
Y10TTechnical subjects covered by former us classification20%
B23KSoldering or unsoldering10%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
C22CAlloys10%
H03HImpedance networks, e.g. resonant circuits10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
PatentTitleYear
7,182,240'Solder coated lid'20077,142,435'Lid for use in packaging an electronic device and method of manufacturing the lid'20066,306,526'Semiconductor packaging metal lid'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2007Patents assigned to SENJU METAL INDUSTRY CO (3)· patent assignee history
2001Patents assigned to SUMITOMO METAL SMI ELECTRONICS (1)· patent assignee history
2001–2006Based in Saitama, JP· patent location history
2007Based in Nishikamo-gun, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SENJU METAL INDUSTRY CO32001–2007
SUMITOMO METAL SMI ELECTRONICS12001
Locations
LocationPatentsSpan
Saitama, JP22001–2006
Nishikamo-gun, JP12007