Inventor
Claes Bjorkman
Inventor
Mountain View, CA, US
Overview
Patents· 40 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01JElectric discharge tubes or discharge lamps14%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables6%
G07DHandling of coins or valuable papers, e.g. testing, sorting by denominations, counting, dispensing, changing or depositing6%
C23CCoating metallic material5%
G02BOptical elements, systems or apparatus5%
B29CShaping or joining of plastics2%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials2%
G07FCoin-freed or like apparatus2%
PatentTitleYear
10,109,138Stacking and dispensing module20189,502,294'Method and system for wafer level singulation'20168,942,461'Method for a banknote detector device, and a banknote detector device'20158,580,615'Method and system for wafer level singulation'20137,985,689'Patterning 3D features in a substrate'20117,458,335'Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils'20087,407,081'Methods and apparatus for transferring conductive pieces during semiconductor device fabrication'20087,227,244'Integrated low k dielectrics and etch stops'20077,110,629'Optical ready substrates'20067,105,442'Ashable layers for reducing critical dimensions of integrated circuit features'20067,072,534'Optical ready substrates'20067,043,106'Optical ready wafers'20066,949,203'System level in-situ integrated dielectric etch process particularly useful for copper dual damascene'20056,902,947'Integrated method for release and passivation of MEMS structures'20056,858,153'Integrated low K dielectrics and etch stops'20056,825,618'Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply'20046,797,639'Dielectric etch chamber with expanded process window'20046,793,835'System level in-situ integrated dielectric etch process particularly useful for copper dual damascene'20046,787,475'Flash step preparatory to dielectric etch'20046,716,302'Dielectric etch chamber with expanded process window'20046,686,293'Method of etching a trench in a silicon-containing dielectric material'20046,669,858'Integrated low k dielectrics and etch stops'20036,598,726'Machine for receiving and enclosing bank notes, where information is printed on the inside of a transparent film'20036,568,154'Method and apparatus for enclosing banknotes where information is printed on the inside of a transparent film'20036,568,346'Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply'20036,553,922'Safe for valuable documents'20036,500,357'System level in-situ integrated dielectric etch process particularly useful for copper dual damascene'20026,403,491'Etch method using a dielectric etch chamber with expanded process window'20026,387,288'High selectivity etch using an external plasma discharge'20026,362,109'Oxide/nitride etching having high selectivity to photoresist'20026,340,435'Integrated low K dielectrics and etch stops'20026,273,022'Distributed inductively-coupled plasma source'20016,232,236'Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system'20016,113,731'Magnetically-enhanced plasma chamber with non-uniform magnetic field'20006,074,514'High selectivity etch using an external plasma discharge'20005,420,922'System for the safe transmission of messages'19955,246,527'Foil-welding arrangement'19935,199,247'Arrangement for enveloping objects in enveloping material taken from two storage reels'19935,031,379'Message receiving arrangement'19913,938,539'Apparatus for leading off air in connection with the measuring of the flow of a liquid'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1976–2015Patents assigned to BJORKMAN CLAES (2)· patent assignee history
1976–2018Based in Stockholm, SE· patent location history
1993–1995Patents assigned to NYBO SEAL SYSTEM AB (3)· patent assignee history
1993Based in Essingeringen, SE· patent location history
2000–2016Patents assigned to APPLIED MATERIALS INC (26)· patent assignee history
2000–2008Based in Mountain View, CA, US· patent location history
2003Patents assigned to NYBOHOV DEV AB (3)· patent assignee history
2005–2016Based in Los Altos, CA, US· patent location history
2006Based in Los Altos Hills, CA, US· patent location history
2011Patents assigned to APPLIED MATRIALS INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 26 | 2000–2016 |
| NYBO SEAL SYSTEM AB | 3 | 1993–1995 |
| NYBOHOV DEV AB | 3 | 2003 |
| BJORKMAN CLAESself | 2 | 1976–2015 |
| APPLIED MATRIALS INC | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mountain View, California, US | 22 | 2000–2008 |
| Stockholm, SE | 8 | 1976–2018 |
| Los Altos, California, US | 5 | 2005–2016 |
| Los Altos Hills, California, US | 3 | 2006 |
| Essingeringen, SE | 2 | 1993 |