Inventor
Osamu Ichikawa
Inventor
Yokohama, JP
Overview
Patents· 83 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G10Lprimary
G10LSpeech analysis techniques or speech synthesis26%
G11CStatic stores9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
G01RMeasuring electric variables5%
G06FElectric digital data processing5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
H10DInorganic electric semiconductor devices4%
B29CShaping or joining of plastics3%
G06NComputing arrangements based on specific computational models3%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for2%
PatentTitleYear
11,106,974Pre-training of neural network by parameter decomposition202110,839,791Neural network-based acoustic model with softening target-layer202010,832,661Sound identification utilizing periodic indications202010,783,882Acoustic change detection for robust automatic speech recognition based on a variance between distance dependent GMM models202010,726,828Generation of voice data as data augmentation for acoustic model training202010,726,326Learning of neural network202010,586,529Processing of speech signal202010,546,238Pre-training of neural network by parameter decomposition202010,460,723Sound identification utilizing periodic indications201910,373,607Testing words in a pronunciation lexicon201910,346,125Detection of clipping event in audio signals201910,217,456Method, apparatus, and program for generating training speech data for target domain201910,062,378Sound identification utilizing periodic indications20189,818,428'Extraction of target speeches'20179,734,821'Testing words in a pronunciation lexicon'20179,640,197'Extraction of target speeches'20179,238,436'Mirror for vehicle'20169,190,072'Local peak weighted-minimum mean square error (LPW-MMSE) estimation for robust speech'20159,184,240'Method of producing semiconductor wafer, and semiconductor wafer'20159,087,513'Noise reduction method, program product, and apparatus'20159,070,375'Voice activity detection system, method, and program product'20159,022,588'Mirror surface angle adjusting device'20158,987,782'Semiconductor structure for forming a combination of different types of devices'20158,930,185'Speech feature extraction apparatus, speech feature extraction method, and speech feature extraction program'20158,872,231'Semiconductor wafer, method of producing semiconductor wafer, and electronic device'20148,812,312'System, method and program for speech processing'20148,802,223'Decorated sheet and molded article integrated with the same'20148,762,137'Target voice extraction method, apparatus and program product'20148,712,770'Method, preprocessor, speech recognition system, and program product for extracting target speech by removing noise'20148,696,342'Waveform monitor apparatus of injection molding machine'20148,566,084'Speech processing based on time series of maximum values of cross-power spectrum phase between two consecutive speech frames'20138,468,016'Speech feature extraction apparatus, speech feature extraction method, and speech feature extraction program'20138,431,459'Semiconductor wafer, semiconductor device, and method of manufacturing a semiconductor device'20138,337,080'Method for measuring temperature distribution of object, and sensor unit'20128,244,800'Virtual space system, method and program'20128,241,806'Fuel cell system'20128,165,317'Method and system for position detection of a sound source'20127,890,321'Noise reduction device, program and method'20117,856,353'Method for processing speech signal data with reverberation filtering'20107,797,154'Signal noise reduction'20107,747,443'Apparatus, method, and program for supporting speech interface design'20107,739,563'Semiconductor integrated circuit and memory test method'20107,729,921'Apparatus, method, and program for supporting speech interface design'20107,720,679'Speech recognition apparatus, speech recognition apparatus and program thereof'20107,698,133'Noise reduction device'20107,599,836'Voice recording system, recording device, voice analysis device, voice recording method and program'20097,590,526'Method for processing speech signal data and finding a filter coefficient'20097,539,071'Semiconductor device with a relief processing portion'20097,537,626'Gas-liquid separator for a fuel cell system onboard a vehicle'20097,481,412'Solenoid-operated cutoff valve for use with fuel cells'20097,478,041'Speech recognition apparatus, speech recognition apparatus and program thereof'20097,372,251'Semiconductor integrated circuit and memory test method'20087,348,595'Semiconductor wiring substrate, semiconductor device, method for testing semiconductor device, and method for mounting semiconductor device'20087,315,479'Redundant memory incorporating serially-connected relief information storage'20087,295,028'Semiconductor integrated circuit and memory test method'20077,249,297'Test method for a semiconductor integrated circuit having a multi-cycle path and a semiconductor integrated circuit'20077,197,725'Semiconductor integrated circuit and testing method for the same'20077,171,600'Semiconductor wiring substrate, semiconductor device, method for testing semiconductor device, and method for mounting semiconductor device'20077,155,643'Semiconductor integrated circuit and test method thereof'20067,079,291'Method for hard-copying web pages, method for printing display screens, system for hard-copying web pages, and internet connection device equipped with current-position detection capabilities'20067,032,196'Semiconductor wiring substrate, semiconductor device, method for testing semiconductor device, and method for mounting semiconductor device'20066,999,823'Power shut-off method for injection molding machine'20066,979,091'Door mirror set plate'20056,917,215'Semiconductor integrated circuit and memory test method'20056,914,274'Thin-film semiconductor epitaxial substrate having boron containing interface layer between a collector layer and a sub-collector layer'20056,734,549'Semiconductor device having a device for testing the semiconductor'20046,615,389'Database for designing integrated circuit device, and method for designing integrated circuit device'20036,514,921'Cleaning agent'20036,410,494'Cleaning agent'20026,271,677'Semiconductor integrated circuit and method for testing the semiconductor integrated circuit'20016,143,705'Cleaning agent'20005,948,082'Computer system having a data buffering system which includes a main ring buffer comprised of a plurality of sub-ring buffers connected in a ring'19995,783,221'Control system for an injection molding machine'19985,028,916'Active matrix display device'19914,752,113'Waterproof optical fiber cable'19884,729,627'Optical fiber cable for detecting low temperature'19884,701,015'Waterproof optical fiber cable and method of the production thereof'19874,647,927'Display device'19874,620,094'Photoelectric encoder'19864,465,543'Apparatus and method for arranging semiconductor pellets'19844,445,132'LED Module for a flat panel display unit'19844,432,131'Method for manufacturing display device'19844,322,735'Display device'1982Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1984–2020Based in Tokyo, JP· patent location history
1987–2021Based in Yokohama, JP· patent location history
1999–2021Patents assigned to IBM (31)· patent assignee history
1999–2011Based in Ebina, JP· patent location history
2001–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (13)· patent assignee history
2001–2010Based in Osaka, JP· patent location history
2009–2014Patents assigned to NUANCE COMMUNICATIONS INC (8)· patent assignee history
2009–2020Based in Kanagawa, JP· patent location history
2012–2016Patents assigned to ICHIKAWA OSAMU (18)· patent assignee history
2012–2015Patents assigned to NISHIMURA MASAFUMI (8)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 31 | 1999–2021 |
| ICHIKAWA OSAMUself | 18 | 2012–2016 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 13 | 2001–2008 |
| NISHIMURA MASAFUMI | 8 | 2012–2015 |
| NUANCE COMMUNICATIONS INC | 8 | 2009–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 16 | 1987–2021 |
| Tokyo, JP | 14 | 1984–2020 |
| Osaka, JP | 12 | 2001–2010 |
| Kanagawa, JP | 10 | 2009–2020 |
| Ebina, JP | 9 | 1999–2011 |