Inventor
Seok Ling Lim
Inventor
Kulim, MY
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H05KPrinted circuits11%
H10DInorganic electric semiconductor devices11%
A61BDiagnosis5%
C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms5%
H01RElectrically-conductive connections5%
PatentTitleYear
11,006,514Three-dimensional decoupling integration within hole in motherboard202110,985,147Capacitors embedded in stiffeners for small form-factor and methods of assembling same202110,978,407Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same202110,964,677Electronic packages with stacked sitffeners and methods of assembling same202110,910,325Integrated circuit packages with conductive element having cavities housing electrically connected embedded components202110,903,155Vertical modular stiffeners for stacked multi-device packages20214,830,011'Catheter tip polarographic lactic acid and lactate sensor for extended use in vivo'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989Patents assigned to LIM SHUN P (1)· patent assignee history
1989Based in Bismarck, ND, US· patent location history
2021Patents assigned to INTEL CORP (6)· patent assignee history
2021Based in Kulim, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2021 |
| LIM SHUN Pself | 1 | 1989 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kulim, MY | 6 | 2021 |
| Bismarck, ND, US | 1 | 1989 |