Inventor
Christian Klewer
Inventor
Dresden, DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10DInorganic electric semiconductor devices20%
PatentTitleYear
10,068,835Process flow for a combined CA and TSV oxide deposition20189,659,840'Process flow for a combined CA and TSV oxide deposition'20179,570,430'Articles including bonded metal structures and methods of preparing the same'20179,536,848'Bond pad structure for low temperature flip chip bonding'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2018Patents assigned to GLOBALFOUNDRIES INC (4)· patent assignee history
2017–2018Based in Dresden, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBALFOUNDRIES INC | 4 | 2017–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dresden, DE | 4 | 2017–2018 |