Inventor
Akira Owatari
Inventor
Tokyo, JP
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
C23CCoating metallic material19%
C25DProcesses for the electrolytic or electrophoretic production of coatings19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
Y10TTechnical subjects covered by former us classification8%
H01LSemiconductor devices3%
H05KPrinted circuits3%
PatentTitleYear
10,941,504Plating method and plating apparatus202110,294,580Plating method and plating apparatus201910,294,581Plating method20199,708,724'Anode unit and plating apparatus having such anode unit'20177,878,144'Electroless plating apparatus and electroless plating method'20117,575,636'Substrate processing apparatus and substrate processing method'20097,498,261'Method and apparatus for forming metal film'20097,442,257'Substrate processing apparatus and substrate processing method'20087,285,492'Method for processing substrate'20077,087,117'Substrate processing apparatus and substrate processing method'20066,824,613'Substrate processing apparatus'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2021Patents assigned to EBARA CORP (11)· patent assignee history
2004–2011Based in Tokyo, JP· patent location history
2017–2021Based in Sacramento, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 11 | 2004–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 7 | 2004–2011 |
| Sacramento, California, US | 4 | 2017–2021 |