Inventor
Kiyonori Kogawa
Inventor
Hiratsuka, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
B29CShaping or joining of plastics11%
B30BPresses in general11%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
Y10TTechnical subjects covered by former us classification11%
C09JAdhesives6%
C23CCoating metallic material6%
PatentTitleYear
5,496,433'Hot press for use in production of multilayered substrate'19965,472,563'Printed circuit board and method and apparatus for making same'19955,182,121'Hot press'19935,021,296'Circuit board and process for producing the same'19914,970,107'Composite article comprising a copper element and a process for producing it'19904,642,161'Method of bonding copper and resin'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–1995Patents assigned to HITACHI LTD (5)· patent assignee history
1987Based in Hadano, JP· patent location history
1990–1996Based in Hiratsuka, JP· patent location history
1993–1996Patents assigned to HITACHI TECHNO ENG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 5 | 1987–1995 |
| HITACHI TECHNO ENG | 2 | 1993–1996 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hiratsuka, JP | 5 | 1990–1996 |
| Hadano, JP | 1 | 1987 |