Inventor
R. Marshall Stowell
Inventor
Wilsonville, OR, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
C23CCoating metallic material11%
G01QScanning-probe techniques or apparatus7%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool3%
B82YSpecific uses or applications of nanostructures3%
C25FProcesses for the electrolytic removal of materials from objects3%
H01LSemiconductor devices3%
PatentTitleYear
10,811,299Wafer chuck assembly202010,435,807Lipseals and contact elements for semiconductor electroplating apparatuses201910,351,968Front referenced anode20199,988,734Lipseals and contact elements for semiconductor electroplating apparatuses20189,816,196'Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte'20179,677,188'Electrofill vacuum plating cell'20179,340,893'Front referenced anode'20169,028,657'Front referenced anode'20158,470,191'Topography reduction and control by selective accelerator removal'20138,415,261'Capping before barrier-removal IC fabrication method'20138,257,781'Electroless plating-liquid system'20128,158,532'Topography reduction and control by selective accelerator removal'20128,043,958'Capping before barrier-removal IC fabrication method'20117,811,925'Capping before barrier-removal IC fabrication method'20107,690,324'Small-volume electroless plating cell'20107,605,082'Capping before barrier-removal IC fabrication method'20097,229,339'CMP apparatus and method'20076,964,792'Methods and apparatus for controlling electrolyte flow for uniform plating'20056,815,349'Electroless copper deposition apparatus'20046,800,187'Clamshell apparatus for electrochemically treating wafers'20046,126,382'Apparatus for aligning substrate to chuck in processing chamber'20005,801,381'Method for protecting a probe tip using active lateral scanning control'19985,773,824'Method for improving measurement accuracy using active lateral scanning control of a probe'19985,360,974'Dual quad flexure scanner'19945,262,643'Automatic tip approach method and apparatus for scanning probe microscope'19935,260,577'Sample carriage for scanning probe microscope'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–1998Patents assigned to IBM (5)· patent assignee history
1993–1994Based in Delray Beach, FL, US· patent location history
1998–2005Based in West Linn, OR, US· patent location history
2000–2019Patents assigned to NOVELLUS SYSTEMS INC (20)· patent assignee history
2000Based in Lakeworth, FL, US· patent location history
2004–2020Based in Wilsonville, OR, US· patent location history
2012–2015Patents assigned to STOWELL R MARSHALL (5)· patent assignee history
2012–2013Patents assigned to KEPTEN AVISHAI (4)· patent assignee history
2012–2013Patents assigned to MAYER STEVEN T (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NOVELLUS SYSTEMS INC | 20 | 2000–2019 |
| IBM | 5 | 1993–1998 |
| STOWELL R MARSHALLself | 5 | 2012–2015 |
| KEPTEN AVISHAI | 4 | 2012–2013 |
| MAYER STEVEN T | 4 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wilsonville, OR, US | 18 | 2004–2020 |
| West Linn, OR, US | 4 | 1998–2005 |
| Delray Beach, Florida, US | 3 | 1993–1994 |
| Lakeworth, Florida, US | 1 | 2000 |