Inventor
CONG LEI
Inventor
CN
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Bprimary
H01BCables25%
H01LSemiconductor devices25%
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
11,380,603Method for making a heat dissipation structure2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to AVARY HOLDING SHENZHEN CO LTD (1)· patent assignee history
2022Patents assigned to HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD (1)· patent assignee history
2022Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVARY HOLDING SHENZHEN CO LTD | 1 | 2022 |
| HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 1 | 2022 |