LexDanaLexDanabeta
Inventor

WUN-KAI TSAI

Inventor
TW

Overview

3→
Patents
2023–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C23CCoating metallic material14%
G05BControl or regulating systems in general14%
H01JElectric discharge tubes or discharge lamps14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
12,057,301Arcing protection method, processing tool and fabrication system202411,721,662Wafer bonding method and wafer bonding apparatus202311,664,206Arcing protection method and processing tool2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2023–2024Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32023–2024
Locations
LocationPatentsSpan
TW32023–2024