Inventor
Ping-Chang Wu
Inventor
Hsinchu County, TW
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1056%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H01LSemiconductor devices9%
H04LTransmission of digital information, e.g. telegraphic communication6%
H04WWireless communication networks3%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use3%
PatentTitleYear
10,742,685Flow control method and device202010,205,776Method and device for wireless connection20199,355,944'Semiconductor device and lead frame having vertical connection bars'20169,190,359'Scribe line structure for wafer dicing and method of making the same'20159,177,836'Packaged integrated circuit device having bent leads'20158,643,158'Semiconductor package and lead frame therefor'20148,610,252'Scribe line structure for wafer dicing'20138,115,320'Bond pad structure located over active circuit structure'20128,080,448'Semiconductor device with nested rows of contacts'20118,039,367'Scribe line structure and method for dicing a wafer'20118,030,778'Integrated circuit structure and manufacturing method thereof'20118,013,425'Scribe line structure for wafer dicing and method of making the same'20117,795,704'Die seal ring and wafer having the same'20107,696,606'Metal structure'20107,649,268'Semiconductor wafer'20107,485,953'Chip package structure'20097,387,950'Method for forming a metal structure'20087,382,038'Semiconductor wafer and method for making the same'20087,129,574'Multi-power ring chip scale package for system level integration'20066,770,963'Multi-power ring chip scale package for system level integration'20046,586,292'Guard mesh for noise isolation in highly integrated circuits'20036,424,022'Guard mesh for noise isolation in highly integrated circuits'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2006Based in Cupertino, CA, US· patent location history
2008–2015Patents assigned to UNITED MICROELECTRONICS CORP (12)· patent assignee history
2008–2015Based in Hsinchu County, TW· patent location history
2011–2016Patents assigned to FREESCALE SEMICONDUCTOR INC (4)· patent assignee history
2011–2016Patents assigned to HE QINGCHUN (4)· patent assignee history
2011–2016Patents assigned to LIU PENG (4)· patent assignee history
2011–2016Patents assigned to WU PING (4)· patent assignee history
2011–2016Based in Tianjin, CN· patent location history
2019–2020Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 12 | 2008–2015 |
| FREESCALE SEMICONDUCTOR INC | 4 | 2011–2016 |
| HE QINGCHUN | 4 | 2011–2016 |
| LIU PENG | 4 | 2011–2016 |
| WU PINGself | 4 | 2011–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 12 | 2008–2015 |
| Tianjin, CN | 4 | 2011–2016 |
| Cupertino, California, US | 4 | 2002–2006 |
| Beijing, CN | 2 | 2019–2020 |