Inventor
Thomas P. Gall
Inventor
Endwell, NY, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits43%
Y10TTechnical subjects covered by former us classification28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
B23KSoldering or unsoldering4%
H01RElectrically-conductive connections4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
B60GVehicle suspension arrangements2%
PatentTitleYear
8,876,122'Level control for vehicles having at least one air spring'20147,570,492'Apparatus for venting an electronic control module'20097,353,983'Vertical removal of excess solder from a circuit substrate'20087,300,820'Adhesive assembly for a circuit board'20077,075,794'Electronic control unit'20066,927,344'Flexible circuit board assembly'20056,749,105'Method and apparatus for securing a metallic substrate to a metallic housing'20046,594,891'Process for forming multi-layer electronic structures'20036,501,661'Electronic control unit'20026,483,037'Multilayer flexible FR4 circuit'20026,098,280'Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes'20005,773,195'Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap'19985,734,560'Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap'19985,709,805'Method for producing multi-layer circuit board and resulting article of manufacture'19985,679,444'Method for producing multi-layer circuit board and resulting article of manufacture'19975,659,951'Method for making printed circuit board with flush surface lands'19975,442,144'Multilayered circuit board'19955,403,420'Fabrication tool and method for parallel processor structure and package'19955,391,514'Low temperature ternary C4 flip chip bonding method'19955,379,193'Parallel processor structure and package'19955,374,344'Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate'19945,363,553'Method of drilling vias and through holes'19945,359,767'Method of making multilayered circuit board'19945,347,710'Parallel processor and method of fabrication'19945,185,073'Method of fabricating nendritic materials'19935,137,461'Separable electrical connection technology'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2003Patents assigned to IBM (17)· patent assignee history
1992–1995Based in Endwell, NY, US· patent location history
1997–2003Based in Lancaster, NY, US· patent location history
1997–1998Based in Lancester, NY, US· patent location history
2002–2006Patents assigned to MOTOROLA INC (5)· patent assignee history
2002–2009Based in Northbrook, IL, US· patent location history
2007–2009Patents assigned to TEMIC AUTOMOTIVE NA INC (3)· patent assignee history
2014Patents assigned to AMK ARNOLD MÜLLER GMBH & CO KG (1)· patent assignee history
2014Based in Ohmden, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 17 | 1992–2003 |
| MOTOROLA INC | 5 | 2002–2006 |
| TEMIC AUTOMOTIVE NA INC | 3 | 2007–2009 |
| AMK ARNOLD MÜLLER GMBH & CO KG | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endwell, New York, US | 10 | 1992–1995 |
| Northbrook, Illinois, US | 7 | 2002–2009 |
| Lancaster, New York, US | 5 | 1997–2003 |
| Lancester, New York, US | 2 | 1997–1998 |
| Ohmden, DE | 1 | 2014 |