Inventor
John J. Ritsko
Inventor
Mount Kisco, NY, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein10%
H05KPrinted circuits10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
G01RMeasuring electric variables5%
H01BCables5%
B24CAbrasive or related blasting with particulate material3%
B82YSpecific uses or applications of nanostructures3%
PatentTitleYear
10,424,101System and method for enabling multiple-state avatars20199,324,173'System and method for enabling multiple-state avatars'20166,890,599'Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays'20056,682,786'Liquid crystal display cell having liquid crystal molecules in vertical or substantially vertical alignment'20046,632,536'Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays'20036,583,847'Self alignment of substrates by magnetic alignment'20036,177,975'Precision alignment of plates'20016,104,466'Precision alignment of plates'20005,599,582'Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier'19975,582,858'Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier'19965,531,022'Method of forming a three dimensional high performance interconnection package'19965,371,654'Three dimensional high performance interconnection package'19945,326,643'Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier'19945,296,189'Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith'19945,185,073'Method of fabricating nendritic materials'19935,170,245'Semiconductor device having metallic interconnects formed by grit blasting'19925,137,461'Separable electrical connection technology'19924,933,635'In-line process monitors for thin film wiring'19904,923,772'High energy laser mask and method of making same'19904,896,464'Formation of metallic interconnects by grit blasting'19904,846,929'Wet etching of thermally or chemically cured polyimide'19894,622,095'Laser stimulated halogen gas etching of metal substrates'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2019Patents assigned to IBM (20)· patent assignee history
1986–2019Based in Mount Kisco, NY, US· patent location history
1990–2016Patents assigned to RITSKO JOHN J (2)· patent assignee history
2003–2005Based in Mount Kisko, NY, US· patent location history
2005Patents assigned to INTELLECTUAL BUSINESS MACHINES (1)· patent assignee history
2016Patents assigned to CASTELLI VITTORIO (1)· patent assignee history
2016Patents assigned to HAMILTON II RICK A (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 20 | 1986–2019 |
| RITSKO JOHN Jself | 2 | 1990–2016 |
| CASTELLI VITTORIO | 1 | 2016 |
| HAMILTON II RICK A | 1 | 2016 |
| INTELLECTUAL BUSINESS MACHINES | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mount Kisco, New York, US | 19 | 1986–2019 |
| Mount Kisko, New York, US | 3 | 2003–2005 |