Inventor
JAMES J. KELLY
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
PatentTitleYear
12,469,787Resist patterned redistribution wiring on copper polyimide via layer202512,438,046Dual redistribution layer structure202511,848,273Bridge chip with through via202311,784,120Metal via structure202311,682,640Protective surface layer on under bump metallurgy for solder joining202311,315,831Dual redistribution layer structure202211,264,306Hybrid TIMs for electronic package cooling202211,251,126Replacement metal cap by an exchange reaction202211,239,167Cu--Cu bonding for interconnects on bridge chip attached to chips and packaging substrate202211,152,298Metal via structure2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to IBM (10)· patent assignee history
2021–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 10 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2021–2025 |