Inventor

Jeffrey J. Farber

Inventor

Delmar, NY, US

Overview

2001–2014

Patent span

Electricity

Primary field (CPC H)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests26%

B08BCleaning in general12%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices9%

B24BMachines, devices, or processes for grinding or polishing6%

C11DDetergent compositions6%

B01DSeparation3%

B82YSpecific uses or applications of nanostructures3%

C25DProcesses for the electrolytic or electrophoretic production of coatings3%

PatentTitleYear

8,726,919'Method and system for uniformly applying a multi-phase cleaning solution to a substrate'2014 8,671,959'Method and apparatus for cleaning a substrate using non-newtonian fluids'2014 8,567,421'Method and system for uniformly applying a multi-phase cleaning solution to a substrate'2013 8,535,451'Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids'2013 8,043,441'Method and apparatus for cleaning a substrate using non-Newtonian fluids'2011 7,913,703'Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate'2011 7,811,424'Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials'2010 7,735,177'Brush core assembly'2010 7,614,411'Controls of ambient environment during wafer drying using proximity head'2009 7,568,490'Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids'2009 7,452,408'System and method for producing bubble free liquids for nanometer scale semiconductor processing'2008 6,939,207'Method and apparatus for controlling CMP pad surface finish'2005 6,645,052'Method and apparatus for controlling CMP pad surface finish'2003 6,405,399'Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing'2002 6,187,684'Methods for cleaning substrate surfaces after etch operations'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2014Patents assigned to LAM RES CORP (15)· patent assignee history

2001–2014Based in Delmar, NY, US· patent location history

2013–2014Patents assigned to DE LARIOS JOHN M (3)· patent assignee history

2013–2014Patents assigned to FARBER JEFFREY (2)· patent assignee history

2013–2014Patents assigned to KOROLIK MIKHAIL (2)· patent assignee history

2013–2014Patents assigned to RAVKIN MIKE (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
LAM RES CORP	15	2001–2014
DE LARIOS JOHN M	3	2013–2014
FARBER JEFFREYself	2	2013–2014
KOROLIK MIKHAIL	2	2013–2014
RAVKIN MIKE	2	2013–2014

Locations

Location	Patents	Span
Delmar, New York, US	15	2001–2014