Inventor
Youichi Hosokawa
Inventor
Tokyo, JP
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Fprimary
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
Y10TTechnical subjects covered by former us classification13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
C08LCompositions of macromolecular compounds5%
C09JAdhesives5%
G02BOptical elements, systems or apparatus5%
H05KPrinted circuits5%
A47CChairs3%
PatentTitleYear
10,932,968Control device and electric furniture202110,185,165Optical waveguide device201910,162,201Optical modulator201810,078,253Optical modulator201810,025,121Optical waveguide element module20189,977,270Optical device20189,778,539'Optical modulation device'20179,570,879'Optical pulse-generator and optical pulse-generating method'20179,523,872'Optical device'20169,250,455'Optical modulator'20168,909,001'Optical modulator'20148,119,737'Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device'20127,947,779'Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer'20117,449,076'Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame'20087,273,654'Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame'20076,523,446'Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2012Patents assigned to HITACHI CHEMICAL CO LTD (5)· patent assignee history
2003–2012Based in Ichihara, JP· patent location history
2012Patents assigned to HATAKEYAMA KEIICHI (1)· patent assignee history
2012Patents assigned to HOSOKAWA YOUICHI (1)· patent assignee history
2012Patents assigned to INADA TEIICHI (1)· patent assignee history
2014–2019Patents assigned to SUMITOMO OSAKA CEMENT CO LTD (10)· patent assignee history
2014–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SUMITOMO OSAKA CEMENT CO LTD | 10 | 2014–2019 |
| HITACHI CHEMICAL CO LTD | 5 | 2003–2012 |
| HATAKEYAMA KEIICHI | 1 | 2012 |
| HOSOKAWA YOUICHIself | 1 | 2012 |
| INADA TEIICHI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 11 | 2014–2021 |
| Ichihara, JP | 5 | 2003–2012 |