Inventor
Reynaldo Co
Inventor
Santa Cruz, CA, US
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices25%
H05KPrinted circuits13%
Y10TTechnical subjects covered by former us classification9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B23KSoldering or unsoldering6%
Y02PClimate change mitigation technologies in the production or processing of goods3%
B29CShaping or joining of plastics2%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
B81BMicrostructural devices or systems, e.g. micromechanical devices1%
PatentTitleYear
10,806,036Pressing of wire bond wire tips to provide bent-over tips202010,756,049Package-on-package assembly with wire bond vias202010,297,582BVA interposer20199,947,641Wire bond support structure and microelectronic package including wire bonds therefrom20189,893,033'Off substrate kinking of bond wire'20189,888,579'Pressing of wire bond wire tips to provide bent-over tips'20189,825,002'Flipped die stack'20179,761,558'Package-on-package assembly with wire bond vias'20179,761,554'Ball bonding metal wire bond wires to metal pads'20179,691,679'Method for package-on-package assembly with wire bonds to encapsulation surface'20179,615,456'Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface'20179,530,749'Coupling of side surface contacts to a circuit platform'20169,508,689'Electrical connector between die pad and z-interconnect for stacked die assemblies'20169,502,390'BVA interposer'20169,412,714'Wire bond support structure and microelectronic package including wire bonds therefrom'20169,349,706'Method for package-on-package assembly with wire bonds to encapsulation surface'20169,252,122'Package-on-package assembly with wire bond vias'20169,153,517'Electrical connector between die pad and z-interconnect for stacked die assemblies'20159,105,483'Package-on-package assembly with wire bond vias'20159,095,074'Structure for microelectronic packaging with bond elements to encapsulation surface'20159,087,815'Off substrate kinking of bond wire'20159,082,753'Severing bond wire by kinking and twisting'20159,041,227'Package-on-package assembly with wire bond vias'20158,884,403'Semiconductor die array structure'20148,878,353'Structure for microelectronic packaging with bond elements to encapsulation surface'20148,836,136'Package-on-package assembly with wire bond vias'20148,772,152'Method for package-on-package assembly with wire bonds to encapsulation surface'20148,680,687'Electrical interconnect for die stacked in zig-zag configuration'20148,404,520'Package-on-package assembly with wire bond vias'20138,372,741'Method for package-on-package assembly with wire bonds to encapsulation surface'20138,324,081'Wafer level surface passivation of stackable integrated circuit chips'20127,923,349'Wafer level surface passivation of stackable integrated circuit chips'20117,863,159'Semiconductor die separation method'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2015Based in Scotts Valley, CA, US· patent location history
2012–2015Patents assigned to CO REYNALDO (8)· patent assignee history
2012–2015Patents assigned to VILLAVICENCIO GRANT (4)· patent assignee history
2013–2020Patents assigned to INVENSAS CORP (29)· patent assignee history
2013–2015Patents assigned to ALATORRE ROSEANN (3)· patent assignee history
2013–2015Patents assigned to CHAU ELLIS (3)· patent assignee history
2013–2020Based in Santa Cruz, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INVENSAS CORP | 29 | 2013–2020 |
| CO REYNALDOself | 8 | 2012–2015 |
| VILLAVICENCIO GRANT | 4 | 2012–2015 |
| ALATORRE ROSEANN | 3 | 2013–2015 |
| CHAU ELLIS | 3 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Santa Cruz, California, US | 27 | 2013–2020 |
| Scotts Valley, California, US | 6 | 2011–2015 |